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Chip combines ESD and EMI protection for audio

Chip combines ESD and EMI protection for audio

New Products |
By eeNews Europe



This product is intended for audio equipment that uses wireless communications in the 2.4 GHz band. Thanks to optimization of its capacitance of 6.8 pF, the multilayer component features high attenuation at this frequency and is able to effectively suppress the generated TDMA noise and thus improve receiver sensitivity. It offers excellent ESD protection according to IEC61000-4-2, Level 4 and has a maximum permissible circuit voltage of 28 V DC, making it suitable for high power class-D amplifiers. Key applications include smartphones, speakers and other wireless devices that operate in the 2.4-GHz band using wireless LAN and Bluetooth, for example.

TDK Corporation – www.tdk.com

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