Chip LED package deliver wide range of operating currents
Coming in a 3.0 mm by 3.0 mm form factor that is popular in LED lighting applications today, the LM301A’s lower and wider current alternatives are a result of Samsung flip chip technology, which allows the LED chip to have the shortest distance from the junction to the base of a package, and eliminates the need for metal wire bonding in the packaging process. These changes enable much lower heat resistance compared to conventional epi-up chip technology – an approximate five percent temperature drop per watt within a more desirable 25°C to 85°C temperature range.
Samsung’s LM301A LED package offers the following light efficacy alternatives:
170 lm/W efficacy in cool white (5000K CCT, CRI80+, 85°C and 65 mA)
160 lm/W efficacy in warm white (3000K CCT, CRI80+, 85°C and 65 mA)
155 lm/W efficacy in cool white (5000K CCT, CRI80+, 85°C, and 150 mA)
145 lm/W efficacy in warm white (3000K CCT, CRI80+, 85°C and 150 mA)
130 lm/W efficacy in cool white (5000K CCT, CRI80+, 85°C, and 350 mA)
120 lm/W efficacy in warm white (3000K CCT, CRI80+, 85°C and 350 mA)
The light efficacy levels make the LM301A package well suited for diverse lighting applications ranging from ambient to high intensity lighting, such as high bays and outdoor lighting. In addition, the performance and cost-competitiveness of the new mid-power package should also be well regarded by lighting fixture manufacturers.
The LM301A features Epoxy Mold Compound (EMC) packaging, which makes it more reliable and extends its lifespan. Compared to existing Polyphthalamide (PPA) and PCT materials now extensively used in LED packaging, Samsung’s EMC packaging offers more protection against heat and UV rays, making it suitable for high-luminance LED applications requiring higher wattage.
The new package also will support CCT (Correlated Color Temperature) specifications ranging from 2700K to 6500K.
The LM301A will be available beginning in July 2015.
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