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Chip scale packaging boost for fast charging

Chip scale packaging boost for fast charging

New Products |
By Nick Flaherty



Alpha and Omega Semiconductor (AOS) has introduced a chip-scale packaging technology for battery fast charging management applications.

MRigidCSP is designed to decrease on-resistance while increasing mechanical strength in chip scale packaging for fast charging designs.

In standard wafer-level chip scale packages (WL-CSPs), the substrate can be a significant portion of the total resistance when back-to-back MOSFETs are employed in battery management applications. A thinner substrate reduces the overall resistance but drastically reduces the package’s mechanical strength.

This reduction of mechanical strength can lead to more stress during the PCB assembly reflow process, potentially causing warping or cracking in the die and, ultimately, failure in the application.

The first part to use the MRigidCSP technology is the AOCR33105E, a 12V common-drain dual N-channel MOSFET. The more robust package technology is particularly suited to battery applications in smartphones, tablets, and ultra-thin notebooks.

The AOCR33105E is designed with the latest trench-power MOSFET technology in a common drain configuration for design simplicity. It features ultra-low on resistance with ESD protection to improve performance and safety in battery management, such as protection switches and mobile battery charging and discharging circuits.

“Incorporating the AOS MRigidCSP packaging technology with our new dual N-channel MOSFET combines electrical performance improvements with the benefit of high robustness. AOS designed the MRigidCSP package technology to be used with high-aspect ratio CSP die sizes, helping to alleviate one of the major causes of battery management application production problems. Our advanced CSP construction delivers a significantly strengthened battery MOSFET that won’t warp or break during the board manufacturing process, making it a higher performance and higher reliability solution,” said Peter H. Wilson, Senior MOSFET Product Line Marketing Director at AOS.

 

Dimensions

VSS
(V)

VGS
(±V)

RSS(on) Max
(mOhms)
@4.5V

RSS(on) Max
(mOhms)
@3.8V

RSS(on) Max
(mOhms)
@3.1V

AOCR33105E

2.08mm x 1.45mm

12

8

3

3.4

4.2

           

 

The AOCR33105E in the MRigidCSP package is immediately available in production quantities with a lead time of 14-16 weeks. It is RoHS 2.0 compliant and is halogen-free, priced at $0.405 in 1,000-piece quantities.

www.aosmd.com

 

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