Chip-size Bluetooth module for wearables, in distribution

Chip-size Bluetooth module for wearables, in distribution

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By eeNews Europe

The 3.5 × 3.5 × 1 mm SESUB-PAN-D14580 module is based on TDK’s Semiconductor Embedded in Substrate (SESUB) technology, reducing the size by 60% compared to modules using discrete components. The single-mode module’s ultra-compact footprint and low current consumption suit it for battery-powered wearable devices.

It integrates a Dialog Semiconductor DA14580 Bluetooth 4.1 chip, 32-bit ARM Cortex-M0 microcontroller, and DC-DC converter onto a thin substrate, along with all peripheral circuitry including a 16 MHz crystal, inductor, and capacitor. All inputs and outputs (I/O) from the substrate layers are routed to a ball grid array (BGA) footprint on the module’s bottom surface. Interfaces include UART, SPI, and I²C, helping to speed the hardware design process. The low-power module requires a voltage supply of 3.0V, and consumes only 5.0 mA when transmitting, 5.4 mA when receiving, and 0.8 µA in standby mode. Output power is rated at 0 dBm (typ.), with a communication range of 10m depending on line of sight and antenna characteristics.


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