Chiplet startup Eliyan now backed by all major memory firms
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Chiplet interconnect startup Eliyan Corp. (Santa Clara, Calif.) has raised US$60 million in a Series B funding round led by Samsung Catalyst Fund and Tiger Global Management.
Existing investors Intel Capital, SK Hynix, Cleveland Avenue and Mesh Ventures also participated in the funding round and Micron Ventures invested in Series A. announced at the end of 2022 (see US$40 million to shake up chiplet interconnect).
In addition to die-to-die interconnect in chiplet-based designs, the company addresses memory capacity and bandwidth in AI chips with the provision of its Universal Memory Interface (UMI). UMI enables a bandwidth-efficient connection to memory, in both standard organic substrates and advanced packaging, the company claims.
Eliyan’s NuLink PHY recently taped out on TSMC’s 3nm process, targeting performance of up to 64Gbits per second per link (see Eliyan tapes out 64Gbit/s chiplet PHY on 3nm).
“At a time when the explosion of AI is driving increasing connectivity needs and the semiconductor industry is undergoing a seismic shift with the rise of multi-die implementation, Eliyan is poised to revolutionize chiplet connectivity technology by unleashing the ultimate performance of chiplet-based systems,” said Srini Ananth, Managing Director at Intel Capital.
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