
Chipmaking equipment spend to rise in 2014
This will take global spending to $39.46 billion in 2014. In 2015 sales are expected to continue to grow — increasing 2.4 percent with Japan, Europe, Korea, China, and Rest of World regions registering positive growth.
The SEMI year-end forecast predicts that wafer processing equipment, the largest product segment by dollar value, will decrease by 10.7 percent in 2013 to total $25.1 billion, on par with 2004 spending levels. Meanwhile the market for assembly and packaging equipment will decline by 22.1 percent to $2.4 billion in 2013. The market for semiconductor test equipment is forecasted to decline by 20.7 percent, reaching $2.8 billion this year.
Taiwan is the largest region for spending at $10.2 billion in 2013 with North American sales totaling $5.7 billion and Korea sales registering $5.5 billion. China is set to overtake Europe in semiconductor manufacturing equipment spending in 2013 at $3.0 billion compared with Europe’s $2.0 billion.
Chipmaking equipment market size (in U.S. dollar billions of U.S.). Source: SEMI December 2013.
The signs of a 2014 uptick are already in place with SEMI reporting a book-to-bill ratio for the 3Q13 of 1.17 with bookings of $8.95 billion exceeding the $7.65 billion of billings recorded in the quarter. The billings figure is 1 percent higher than the second quarter of 2013 and 16 percent lower than the same quarter a year ago. The data is gathered jointly with the Semiconductor Equipment Association of Japan.
The bookings figure of $8.95 billion in the third quarter of 2013 is 33 percent higher than the same quarter a year ago and 2 percent lower than the same figure for the second quarter of 2013.
Quarterly chipmaking equipment billings data by region (in billions of U.S. dollars). Source: SEMI and the Semiconductor Equipment Association of Japan.
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