ChipSESD protection devices combine active ICs with passive SMT packaging
Normal
0
false
false
false
EN-GB
X-NONE
X-NONE
/* Style Definitions */
table.MsoNormalTable
{mso-style-name:”Table Normal”;
mso-tstyle-rowband-size:0;
mso-tstyle-colband-size:0;
mso-style-noshow:yes;
mso-style-priority:99;
mso-style-parent:””;
mso-padding-alt:0cm 5.4pt 0cm 5.4pt;
mso-para-margin-top:0cm;
mso-para-margin-right:0cm;
mso-para-margin-bottom:10.0pt;
mso-para-margin-left:0cm;
line-height:115%;
mso-pagination:widow-orphan;
font-size:11.0pt;
font-family:”Calibri”,”sans-serif”;
mso-ascii-font-family:Calibri;
mso-ascii-theme-font:minor-latin;
mso-hansi-font-family:Calibri;
mso-hansi-theme-font:minor-latin;
mso-bidi-font-family:”Times New Roman”;
mso-bidi-theme-font:minor-bidi;
mso-fareast-language:EN-US;}
Available in 0201 and 0402 sizes, Chip SESDs are easier to install and re-work than traditional semiconductor-packaged ESD devices, as they operate bi-directionally and can be placed onto a PCB with no orientation constraints, eliminating any need for polarity inspection.
More, while conventional ESD diode packaging has pads on the bottom of the device, the passive packaging of ChipSESDs allows for easy solder inspection after PCB mounting. Electrical specifications include a surge rating of 2A under 8×20µs surge and an ESD rating of 10kV contact discharge.
The devices’ low-leakage current (1.0µA max) reduces power consumption and a fast response time (<1ns) helps equipment to pass IEC61000-4-2, level 4 testing. Their input capacitance of 4.0pF (0201 package) and 4.5pF (0402 package) makes them suitable for applications such as mobile phones and portable devices, digital cameras/camcorders, computer I/O ports, speakers, headphones and low-voltage DE lines.
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