Chipset enables fast wireless charging
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By
eeNews Europe
Built in Toshiba’s mixed-signal process with optimised MOSFETs the chipset achieves high-efficiency wireless charging performance. The TB6865FG integrates an MCU that can drive four external MOSFET H-bridges of four coils for a free positioning architecture supporting two mobile devices. The TC7763WBG receiver combines modulation and control circuitry with a rectifier power pickup, built-in low-dropout linear regulator (LDO) and circuit protection functions. The transmitter IC is housed in LQFP-100 14 x 14 mm package and the receiver IC is supplied in a WCSP-28 2.4 x 3.67 x 0.5 mm package.
The recently announced TC7761WBG IC has been awarded Qi certification for an output power of 3.5 W.
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