The chipset so far was available only as part of a development system, Now it is available to designers everywhere. It includes the MLX75023 1/3-inch optical format ToF sensor and the MLX75123 companion IC that embeds many of the external components normally required to develop a 3D vision solution. With this high level of integration, designers no longer have to be concerned with expensive, space-hungry external FPGAs and ADCs, Melexis promises. The chipset thus does not only reduce size but also design cost, product cost and time-to-market.
The MLX75023 ToF sensor offers the world’s smallest pixel at QVGA resolution with 63 dB linear dynamic range and sunlight robustness. The MLX75123 companion chip interfaces directly the sensor IC to a host MCU and provides rapid readout of data from the sensor.
The modular approach taken in designing the chipset means that the sensor can be changed or upgraded without having to change the product architecture. This allows the design of multiple solutions with the same base design as well as rapid implementation of new sensors as they reach the market.
Besides automotive applications, the chipset is suited for other applications including Industrial (conveyer belts, robotics, volume measurement) and Smart Cities (people counting, security, etc.). The chipset is available in both automotive (-40°C to +105°C) and industrial (-20°C to +85°C) grades.
More information: www.melexis.com