CIL starts shipments from UK cleanroom

CIL starts shipments from UK cleanroom

Business news |
By Nick Flaherty

Custom Interconnect Ltd (CIL) has started production of all its microelectronics and power device from its new semiconductor cleanroom in Andover UK.

The ISO7 cleanroom at CIL contains a segregated room with specialist LED lighting to house CIL’s wafer dicing capability complete with DISCO DAD3361 dicing saw, water treatment and wafer mounting equipment. CIL is now receiving custom die from its customers, dicing and then providing full assembly services either into custom packaging solutions or bespoke devices for SMT assembly within CIL.

CIL plans UK’s largest power semiconductor packaging plant


Cleanroom qualification was completed at the end of May 2023, the changing rooms and cleanroom transfer room were qualified to ISO8 and the 15,000sq ft cleanroom was independently qualified to ISO7 (class 10,000). Over the next 2 months, all of CIL’s remaining semiconductor packaging equipment and personnel will transfer into this facility, leaving room for further expansion and investment in the 32,000sq ft manufacturing space in the existing facilities at CIL House.

The plan is for the facility to have a wider range of equipment by the middle of September 2023 including six 3D printers. This includes two DATACON 2200EVO Auto die bonders for die placement using Si, SiC, GaN, GaAs devices, two HACKER Auto die bonders mainly placing Si based devices and two manual die bonders as well as five ASM 589 Auto Al/Au wedge bonders.

For testing and verification the plant will have a DAGE Quadra7 X-Ray/CT Scan system, Nordson GEN7 Scanning Acoustic Microscope (CSAM) and Keyence VHX7000 Digital Microscope with sub-micron laser measurement.

A Boschman Sinterstar Innovate F-XL sinter press will be used for silver sintering of SiC & GaN die, SiC & GaN packaged devices and power module to base plate sintering along with a Boschman Pre-heat and cooling tower system for silver sintering.

A Boschman UNISTAR Auto plastic overmold machine will be capable of over-moulding BGA’s, LGA’s, QFN’s, Plastic IC’s, Power discrete and Power modules with a Scheugenpflug VDS U1000 / LP804 VDU Auto epoxy fill system.

Further equipment already on order and due to be delivered in 2023 includes a DATACON 2200EVO Auto die bonder to bring the total up to five, an extra ASM 589 Auto Al wedge bonder and a third Nordson Asymtek S2-920 Auto dispense system.

CIL says it is now on an almost permanent recruitment drive for engineers, technicians and staff to join the 60 staff at the site.






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