Clamshell BGA socket with Bluetooth temperature monitoring
The contactor comprises a stamped spring pin with 17 gram actuation force per ball and cycle life of 500,000 insertions. The self inductance of the contactor is 0.98 nH, while insertion loss is <1 dB at 21.9 GHz. The current capacity of each contactor is 4-A at 30°C temperature rise. Socket temperature range is -55°C to +180°C. The socket also features a floating guide for precise ball to pin alignment.
The BGA socket also features a Bluetooth electronic module integrated into the top portion of the socket (compression plate). A thermo couple sensor is brought down from the electronic circuitry to the internal socket cavity where the BGA is placed. When the BGA is placed and compressed against the PCB via the contact element, the thermo couple touches the top BGA surface. Power supply is applied to the BGA to start its function.
As the BGA starts functioning, heat is generated. This heat is sensed by the thermo couple and fed to the electronic circuitry where it is processed and the temperature is displayed via a Bluetooth mobile app. The app monitors temperature continuously and provides results in graphical format. This feature is very useful in the test world during BGA characterization. All BGA sockets can be integrated with this smart feature depending on space availability. Custom features can be added to any of the company’s standard BGA sockets as well.