CMOS image sensor for automotive cameras uses silicon-on-silicon packaging
The TCM5126GBA integrates a high dynamic range (HDR) function that reproduces high quality images of objects backlit by the sun and vehicle headlights. The CMOS image sensor has a pixel size of 5.6 μm and a full resolution frame rate of 60 fps.
The use of through-silicon-via (TSV) technology, which forms electrical interconnects through a silicon die, enables sensor to fit in a small chip-size package (CSP) 30% smaller than equivalent products. This in turn will contribute to the downsizing of view camera systems.
The sensor also incorporates a picture flip function that can flip output images horizontally and vertically, an on-screen display function that outputs parking guidelines together with the image, and a zoom function for use in rear view cameras in parking assist systems. The built-in timer function sustains output of images when the gear stick is shifted from reverse to forward, allowing drivers to see a continuous movie when reversing into a parking space.
Stand-alone operation support (SAOS) function enables the sensor to operate automatically when power is supplied, without external microcontrollers, and will contribute to the simplification of automotive view systems.
Toshiba Electronics Europe; www.toshiba-components.com
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
eeNews on Google News
