Conductive adhesive enables solder replacement and lower temperature processing
Featuring a moderate glass transition temperature (Tg) and modulus, the adhesive has an optimized rheology for screen printing and can be needle dispensed by time-pressure, auger or positive displacement. CA-102 is modified to provide conductivity stability during damp heat testing on tin, silver and copper surfaces. It is suitable for applications requiring lower stress, lower temperature processing or elimination of Pb in solder.
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