Conductive die attach films for leadframe packages
Normal
0
false
false
false
EN-GB
X-NONE
X-NONE
/* Style Definitions */
table.MsoNormalTable
{mso-style-name:”Table Normal”;
mso-tstyle-rowband-size:0;
mso-tstyle-colband-size:0;
mso-style-noshow:yes;
mso-style-priority:99;
mso-style-parent:””;
mso-padding-alt:0cm 5.4pt 0cm 5.4pt;
mso-para-margin-top:0cm;
mso-para-margin-right:0cm;
mso-para-margin-bottom:10.0pt;
mso-para-margin-left:0cm;
line-height:115%;
mso-pagination:widow-orphan;
font-size:11.0pt;
font-family:”Calibri”,”sans-serif”;
mso-ascii-font-family:Calibri;
mso-ascii-theme-font:minor-latin;
mso-hansi-font-family:Calibri;
mso-hansi-theme-font:minor-latin;
mso-bidi-font-family:”Times New Roman”;
mso-bidi-theme-font:minor-bidi;
mso-fareast-language:EN-US;}
The Ablestik C100 series is available in two formulations, Ablestik C130 and Ablestik C115 supplied in 30 micron and 15 micron thicknesses, respectively. Among the established benefits are the elimination of die tilt, the ability to process thinner die and facilitation of greater bondline control, all of which allow for improved processing, higher yields and better long-term reliability.
The Ablestik C100 series film die attach materials also provide a high degree of manufacturing latitude, as their workability has been established on die sizes ranging from 1x1mm up to 6x6mm for a variety of package types including both QFNs and QFPs. In addition, the materials’ better wetting ability with lower bonding temperature provides extremely stable adhesion strength, allowing robust adhesion against moisture and MSL Level 2 performance on all leadframe surface finishes.
Visit Henkel Electronics at www.henkel.com
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