The modules are all based on the new low-power Tiger Lake SoCs which provide offer higher CPU performance, as well as almost 3x higher GPU performance and PCIe Gen4 and USB4 support. The 12 new congatec COM-HPC and COM Express Computer-on-Modules will be ideal for fanless edge applications in harsh industrial and embedded environments. The new range of modules will be especially suitable for AI applications, with inference workloads running across all four CPU cores, or on up to 96 graphics execution units of the Intel Iris Xe graphics technology.
“One of the most impressive features besides state-of-the-art PCIe Gen4 and USB4 support is the massively increased bandwidth of the new Intel Iris Xe graphics. The performance has nearly tripled compared to predecessor modules based on 8th Gen Intel Core processor technology. This opens up a multitude of new opportunities in the graphics intensive medical imaging and immersive digital signage sectors, as well as in the industrial machine vision and AI based public safety sectors where capturing and analyzing several video streams in real-time is critical for object recognition,” says Gerhard Edi, CTO at congatec.
“For demanding IoT applications like collaborative robotics, autonomous vehicles, AI, or contactless retail markets, congatec’s 11th Gen Intel Core processor based modules take advantage of the ‘total compute’ capabilities of the CPU and GPU. In combination with Intel Time Coordinated Computing technologies, extensive virtualization, and in-band error correction, these new platforms help minimize jitter and are ideal to meet the demands of critical real-time computing applications,” underlines Jonathan Luse, Senior Director, Intel’s Industrial Solutions Division
To help developers make the best choice between COM Express and COM-HPC, congatec provides engineering support and has created a COM Express vs COM-HPC design decision guide. This can be downloaded from the product pages of the conga-HPC/cTLU COM-HPC Client module and the conga-TC570 COM Express Compact module.
The conga-HPC/cTLU COM-HPC Client Size A module and the conga-TC570 COM Express Compact module support PCIe x4 in Gen 4 performance to provide large bandwidth for connected peripherals. In addition, both modules offer 8x PCIe Gen 3.0 x1 lanes. The COM-HPC module has 2x USB 4.0, 2x USB 3.2 Gen 2, and 8x USB 2.0, while the COM Express module offers 4x USB 3.2 Gen 2 and 8x USB 2.0 in compliance to the PICMG specification.
COM-HPC modules offer 2x 2.5 GbE for networking, while COM Express modules feature 1 x GbE. Both support TSN. Sound is provided via I2S and SoundWire in the COM-HPC version, and HDA in the COM Express modules. Board support packages are provided for all leading RTOS’s, including hypervisor support from Real-Time Systems as well as Linux, Windows and Chrome.