Highlights on the booth will include presentations on the upcoming PICMG COM-HPC standard as well as the company’s extended SMARC ecosystem for the NXP i.MX8 family. The SMARC ecosystem combines the seamless use of MIPI camera technology and artificial intelligence, as well as other benefits. A new SMARC starter kit for real time workload consolidation will be on the stand, as well as presentations from Basler and Hacarus. The stand will also show fanless cooling solutions for robust embedded servers and systems that can dissipate up to 100 watts of TDP.

The COM-HPC presentations will focus on the pre-released pinout of the specification. It will highlight the different form factors and versions for embedded edge servers and embedded clients. The edge server variants featuretwo footprints, offering up to 64 PCIe lanes, 8x 25 GbE, and up to 8 DIMM sockets for 1 TB of RAM. Smaller COM-HPC client modules come in three different footprints. These interfaces have four video interfaces and two camera inputs, and offer up to 4 SODIMM sockets.

The SMARC and Qseven presentations will focus on the ecosystems for the energy-efficient and versatile NXP i.MX8 processor family. congatec will show solutions for vision, AI and WiFi implementation. All are designed to make it easier for customers to integrate the new processors – from the i.MX 8X, to the i.MX 8M Mini, and the i.MX8. For a fast start, congatec provides individually compiled binaries through Git-Hub that allow the direct boot of platforms.

congatec will also showcase an AI Development Kit that has been developed with Hacarus. The new kit allows the evaluation of sparse modelling based AI. The kit features an AI system based on congatec Qseven modules with Intel ‘Apollo Lake’ processors. Sparse modelling allows AI training tasks to be accomplished on the edge.

More information

embedded world

Hall 1, Booth 358

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