congatec targets real time processing for 5G

New Products | November 4, 2021

By Nick Flaherty

congatec points to the high demand for 5G edge technologies, especially among OEMs in the mobility, transportation, logistics and smart city markets, but also among industrial mobile machinery and robotics vendors. These all need new embedded platforms, most often with real-time capabilities with the ability to control these new platforms over the air with zero downtime to enable a totally new generation of smart mobile and stationary devices.

It has launched a series of Computer-on-Modules specifically designed for industrial-grade edge appliances with ‘out-of-band’ management over IP connectivity even when the devices are down.

“Most important for OEM equipment and embedded system design houses are currently the Intel Core processors based congatec modules that support the extended temperature ranges, which makes them a perfect fit for all outdoor equipment – whether mobile, portable or stationary,” said Martin Danzer, director of product management at congatec.

“The latest congatec modules with soldered RAM also deliver great advantages as they are qualified for applications exposed to extreme shock and vibrations. All modules provide opportunity to deploy TSN capable real-time connected OTA services and Device2x communication. In addition, we also offer virtual machine implementations for enabling different tasks and domains on a single device,” said congatec’s Director Product Marketing and adds: “Target platforms, upon which our customers can realize their 5G strategies, range from high-end edge server to low power client platforms.”

Two new module families based on the COM-HPC specification support based on the 11th Gen Intel Core vPro, Intel Xeon W-11000E, and Intel Celeron processors are designed for the most demanding IoT gateway and edge computing applications requiring highest bandwidth with up to 20 PCIe Gen 4 lanes.

A starter set is available for both the conga-HPC/cTLU and conga-HPC/cTLH COM-HPC Client modules support application development via the conga-HPC/EVAL-Client carrier board, which is based on the ATX form factor. This is highly efficient as engineers can utilize standard PC components for their embedded system designs.

A COM Express Type 6 conga-TS570 module based on the new Tiger Lake H processor can be used for massive connected real-time IIoT gateway, edge computing and micro server workloads. With extended temperature ranges of -40°C to +85°C. For 24/7 connected fanless embedded systems, the conga-TCV2 COM Express Compact Computer-on-Modules based on AMD Ryzen Embedded V2000 processors are another attractive option.

Congatec has worked with Intel and Real-Time Systems on a demonstration system with real time TSN support for 5G connected appliances. The system is qualified by Intel as a ready for production unit and integrates three preconfigured virtual machines to demonstrate how various tasks can be executed on a single platform with full determinism – even if one virtual machine is booting. The 5G enabled platform targets collaborative systems, and is preconfigured to include vision and AI for improved situational awareness.

For OEMs requiring 5G connected edge server level computing power, congatec’s COM Express Type 7 Server-on-Modules based on the AMD EPYC 3000 Embedded processors support up to 16 cores. Multiple cores open even more options for workload consolidation by utilizing virtual machines on the basis of hypervisor technology from Real-Time Systems. As the EPYC 3000 Embedded processors consume up to 100W TDP, congatec has also designed appropriate cooling solutions, making system integration of these high-end embedded platforms an easy task.

www.congatec.com

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