Copper glass-coated semiconductor bonding wire scales down to 4 microns
Shimon Dahan, CEO of RED Micro Wire sees this solution as a highly reliable alternative to using gold wire, which until now has been known as the standard, claiming that the new semiconductor wire is as ‘good as gold’.
Unlike traditional wires, RMW’s wires are cast, not drawn. This enables the production of a soft metal core with a high strength, ultra-fine glass coating. The company’s innovative control-over-core and glass coating enables unmatched synergetic efficiency. “Advanced packaging technology is recognized as an essential ingredient in delivering cost-effective semiconductor solutions to a variety of electronic applications today.
Manufacturers are challenged in adopting new technologies for wire bonding,” said Joanne Itow, analyst, Semico Research Corp. “If RED Micro Wire can show cost-efficiencies in addition to their ability to deliver scalability, quality and yield as compared to current packaging technology, the industry should be very excited by the company’s glass-insulated bonding wire.”
The new bonding wire eliminates anti-oxidation issues, enabling a longer shelf life while able to support larger spools for simpler materials management. It protects against “shorts” since the wire is coated and cannot make contact. The wire can be scaled down to 4 microns, far smaller than the 14-16 micron minimum of other wire solutions, enabling it to support designs of the future and the overall scalability of the industry. The glass coating also enables relaxed design rules since the wire is not exposed. RMW research and development is done in Israel and manufacturing is planned to be at RED premises in Singapore, providing the best proximity to major Asia Pacific assembly and packaging vendors.
Visit RED Micro Wire at www.redmicrowire.com
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