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EENews Europe

EENews Europe

Post Titles

Bridging the Physical and Digital World – The Minverse 3d haptic mouse
‘Bean’ me up..into the cloud!
Ansys tests out optical processing for automotive modelling 
Hirose launches industry’s smallest 0.6mm crimp power connector
Challenging 2024 hits GlobalFoundries
Lauterbach teams for cloud-based automotive development
H-bridge drivers for brushed DC motors boost efficiency
TÜV SÜD warns of battery regulation deadline
CEA, AMD team on next generation sustainable AI hardware
Ultimate bitcoin mining
Aduna and Sinch partnership expands ecosystem for network APIs
Tapeout of clock IP on 2nm silicon
VW names €20,000 electric car
France joins the AI datacentre express with $20bn deal
FAMES details FD-SOI pilot line commercial partners
NXP to buy US edge AI chip startup Kinara for $307m
Fuzzy logic Arduino boost for shaded PV panels
Power Integrations CEO to retire
TNO and Fraunhofer deliver Germany’s quantum internet node
Track wild animals with smart microphones
Segger adds real-time multicore analysis to SystemView
Advanced chiplet packaging deal in Arizona
ARM achieves sales above guidance but outlook disappoints
Signal conditioning chip for position sensors
3A POL switching regulator as drop in linear replacement
BorgWarner wins four Chinese EV motor deals
All-in-one cloud-based edge network testing and monitoring at scale
VyOS acquires Accel-PPP to drive open-source networks
Margaret Martonosi on Trustworthy Computer Architectures
Low-power Bluetooth LE modules target mass market applications
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