Credit-card sized COM module for rapid development of ultra-small embedded solutions

Credit-card sized COM module for rapid development of ultra-small embedded solutions

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By eeNews Europe

Measuring 84mm x 55mm, the VIA COMe-8X91 is based on the industry standard Computer-on-Module (COM) Express Mini form factor with type 10 pin-outs. The VIA COMe-8X91 module combines an 800MHz VIA EdenTM X2 dual core processor and the VIA VX900 media system processor (MSP) providing a ruggedized, ultra compact solution targeted at industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, test and measurement, industrial (machine vision system) and military applications.
In addition to the COMe-8X91 module, VIA offers a comprehensive starter kit, including a multi-I/O carrier board reference design, board support packages (BSPs), display, system monitoring tools/SDKs, and design guide, enabling industrial PC and OEM customers to rapidly customize their solutions.
“The COM Express Mini form factor provides embedded customers the ideal platform for creating highly tailored solutions where real estate is at a premium,” said Epan Wu, Head of the VIA Embedded Platform Division at VIA Technologies. “The VIA COMe-8X91 delivers an extremely ruggedized, power efficient solution for the creation of ultra compact embedded devices with a short time to market approach.”
The COMe-8X91 module offers support for the latest connectivity standards including 18/24-bit single-channel LVDS and either one displayport or one HDMI port (without HDCP). Onboard I/O includes two SATA II ports, one GigaLAN port, eight USB 2.0 ports shared with one USB client port, one HD audio digital interface and two serial ports. System memory includes 1GB of onboard DDR3.

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