CSP sockets enable testing of any area-array device to +200°C
For the first time, applications that require high-temperature device testing and burn-in, as well as those with high-frequency bandwidth, low inductance and high current conditions, can now incorporate cost-effective and high-reliability CSP socket technology to test and burn-in virtually any area-array device at temperatures up to +200°C. The AR4HT sockets accommodate a variety of area-array devices including BGA, LGA, QFN, DFN, CSP, MLCC and POP as well as bumped die with full and partial arrays. Full socket operating temperature is -55 to +200°C with a life expectancy of more than 10,000 actuations. The socket can accommodate IC devices with a pitch of 0.4 mm or greater as well as mixed pitch environments. The interposer set is comprised of silver particles within a silicon elastomer with a patented polyimide core. Initial contact force is 20 to 30 grams per lead. The socket is available in custom sizes and configurations to suit specific customer applications.
Get the datasheet
Visit Aries Electronics at www.arieselec.com
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
