CUI adds aluminium and copper BGA heat sinks
The Thermal Management Group at CUI Devices has expanded its line of BGA heat sinks.
The HSB family of BGA heat sinks from CUI Devices now offers aluminium or copper material options, clean or black anodized material finishes, and adhesive or PCB mounting styles.
All the BGA heat sink models are measured under four conditions for thermal resistance, making it easier for designers to select the optimal heat sink for their natural convection or forced air cooled system.
The heat sinks are compatible with ball grid array (BGA) devices from 8.5 x 8.5 mm up to 69.7 x 69.7 mm with profiles from 5 to 25 mm and have thermal resistances from 3.45 to 39.1°C/W at 75°C ΔT in natural convection and power dissipation ratings from 1.92 up to 21.74 W at 75°C ΔT in natural convection.
The HSB models are available immediately with prices starting at $0.51 per unit at 500 pieces through distribution.
The Resource Library houses a range of blog posts, videos, and more information on designing with heat sinks.
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
