CUI Devices launches thermal design service
The Thermal Management Group of CUI Devices has launched a thermal design service.
The team of thermal management experts at CUI Devices will use simulation tools and decades of expertise to identify potential hotspots, optimize airflow, and design effective cooling systems tailored to a customer’s specific needs.
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The available services include thermal simulation with computational fluid dynamics (CFD) techniques to accurately predict and optimize the airflow, temperature distribution, and heat transfer in various systems as well as standard thermal management products and the design of custom thermal management solutions, including product customizations and integrations.
From conducting PCB modeling and optimization to providing expertise in system, housing, and chassis design, CUI Devices can help designers maximize their thermal management strategy and thermal testing services ensure the accuracy and reliability of a thermal design through real-world testing to help identify and address any potential discrepancies.
“Thermal challenges are an inescapable fact in today’s electronic devices,” stated Steve Mathis, CUI Devices’ VP of Sales. “Our new thermal design services are a natural progression of our existing portfolio of thermal management products. We also have many years of experience collaborating with customers to tailor custom thermal solutions to their specific application needs and we believe these additional services will further simplify their design journey.”
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