CXMT to invest US$2.35 billion in AI memory packaging fab

CXMT to invest US$2.35 billion in AI memory packaging fab

Business news |
By Peter Clarke

Chinese DRAM maker ChangXin Memory Technologies Inc. (CXMT) is set to spend 17.1 billion yuan (about US$2.35 billion) to build an advanced packaging plant in Shanghai, according to Bloomberg.

The investment funds will come from CXMT’s parent company Innotron, and the plant used to manufacture of high-bandwidth memory (HBM) DRAM components which assemble multiple die together. HBM components are used for AI acceleration within datacenter servers.

Bloomberg reports that Innotron signed a contract with local government in June via a Shanghai subsidiary to secure land for the advanced assembly fab, which is due to start production in mid-2026. To help fund the fab Innotron made a deal to raise 10.8 billion yuan in March, Bloomberg said.

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