DDR4 in high-density Module-In-A-Package targets IioT
The Module-in-a-Package is an innovative, tiny form factor design targeted for uses in IIoT, embedded computing, broadcast video, and mobile routers, where maximising DRAM capacity within space-constrained limitations are a principle concern.
Operating up to DDR4-3200, the MIP solution replaces multiple down-board DRAMs or SO-DIMMs to maximize DRAM density within minimal board space. It enables a simplified system design with all the necessary passives and a thermal sensor, eliminating the need to place these components. The package also removes the need for a mating connector, resulting in better signal integrity and reduced flight time. The 16GB MIP is available in two configurations, the standard 1Gx64 version or the two channels of x32 configuration to replace either soldered down DRAMs or SO-DIMMs. The MIP is well suited for MCU, CPU, or FPGA-based embedded computing and IIoT systems that require a x64 or x32 memory access. For example, a small form factor COMe system for IIoT can be populated with 128GB of memory using four 16GB MIPs on the top of the system and four 16GB MIPs mirrored on the bottom.
SMART Modular Technologies – www.smartm.com
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