Design guide supports high speed COM Express signals

Design guide supports high speed COM Express signals

Technology News |
A new design guide has been necessary to handle new high speed signal in the latest version of the PICMG COM Express specification.
By eeNews Europe

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Revision 2 of the COM Express Carrier Design Guide includes design rules and guidance for the latest high-speed interfaces in 2.1 of the spec, including PCI Express Gen3, SuperSpeed USB, SATA 6Gb/s, and reference schematics for digital display interfaces (DDI) to support HMDI, DVI and DisplayPort outputs. The new guide is available for download without charge on both the PICMG and ADLINK websites.
“Significant time and effort was spent on simulation of the newly adopted high-speed signals to ensure design rules that result in working carrier boards,” said ADLINK’s CTO, Jeff Munch, who chaired the special PICMG subcommittee, keeping the process moving forward through final release of the latest document.
Revision 2 of PICMG’s COM Express Carrier Design Guide provides information for designing a custom system carrier board for COM Express modules. The Design Guide includes reference schematics for the external circuitry required to implement the various COM Express peripheral functions and explains how to extend the supported buses, as well as how to add peripherals and expansion slots to a COM Express-based system.
“On-going updates are critical to enable full-featured designs using any open specification, particularly one as accepted in the embedded vendor community as COM Express,” said Joe Pavlat, president and chairman of the PICMG consortium.
The Design Guide contains additional information, but does not replace PICMG’s COM Express specification. For complete guidelines on the design of COM Express-compliant carrier boards and systems, refer also to the full COM Express specification at: https://www.picmg.org/v2internal/resourcepage2.cfm?id=3
Founded in 1994 as the PCI Industrial Computer Manufacturers Group, PICMG is a consortium of over 250 companies that collaboratively develop open specifications for high performance telecommunications, military and industrial computing applications.
www.picmg.org
www.adlink.com

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