DFN3020 packaged MOSFETs use 70 percent less space

DFN3020 packaged MOSFETs use 70 percent less space

New Products |
By eeNews Europe

The dual DFN3020 MOSFETs offer a comparable electrical performance as much larger SOT23 packaged parts and will replace two separate SOT23 packaged MOSFETs, resulting in a board space saving of 70%.

With a footprint of just 6 mm2 and an off-board height of 0.8 mm, some 40% less than SOT23 or TSOP-6 packaged parts, the DFN3020 MOSFET portfolio will suit load switch or boost conversion circuits in space-constrained low profile portable consumer electronics including tablets and netbooks.  The complementary DFN3020 MOSFETs will also function well as a half bridge for driving motor loads in industrial applications.

The MOSFETs’ junction to ambient thermal resistance of 83 degrees C/W also means that power dissipation is high, at up to 2.4 W continuous and operating temperatures are cooler than achievable with SOT23 packaged MOSFETs leading to increased reliability.

Availability and Pricing

The ZXMN2AMC (dual 20 V N-channel), ZXMN3AMC (dual 30 V N-channel) and ZXMC3AMC (complementary 30 V) DFN3020 packaged MOSFETs are available for $0.23 each in quantities of 10k.  

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