Dialog extends PMIC deal with Renesas

Dialog extends PMIC deal with Renesas

Business news |
By Nick Flaherty

Dialog Semiconductor is expanding its collaboration with Renesas Electronics on power management IC (PMIC) chips for automotive.

The two had already worked on the Renesas R-Car Gen 2 and R-Car H3 platforms, and they are expanding to the R-Car M3 and R-Car E3 platform using the DA9063-A system PMIC and the DA9224-A sub PMIC. Each device is configured to meet the specific power rail requirements including voltage levels, peak currents and power sequencing for the automotive platforms.

The optimisation of the PMIC chips reduces the form factor at a low bill of materials (BoM) cost, while easing thermal design complexity, a critical factor in the adverse temperature environments of automotive systems.

“The expanded collaboration between Dialog and Renesas enables the leading automotive Tier-1 suppliers to deliver differentiated, reliable, high-performance and cost-effective electronic systems based on the industry leading R-Car platforms,” said Tom Sandoval, Senior Vice President, Automotive Business Segment, Dialog Semiconductor. “As processing power demands and platform specific requirements continue to increase across automotive systems, our collaboration with Renesas delivers significant benefits to our joint customers.”

The partitioning of system-level power delivery into highly configurable system PMICs and sub-PMICs enables scalability and flexibility in the power management design. This means a wide variety of SoC system power specifications can be easily met using the same PMIC devices, allowing designers to optimise their power requirements throughout the design process. 

“Automotive electronics designers can easily make power configuration and sequencing changes to meet their SoC system with Dialog’s flexible, scalable power solutions. Our joint work with Renesas enables SoC solutions with best-in-class power efficiency,” said Sandoval.

The DA9063-A system PMIC and the DA9224-A sub-PMIC feature significant scalability and flexibility advantages while distributing heat dissipation in elevated temperature environments. The built-in configurability engines provide system designers with the ability to easily solve their power sequencing, thermal and system control challenges. An intuitive GUI (Smart Canvas) simplifies the customization to achieve the optimised power management design. 

All devices are available as full AEC-Q100 Grade 2 qualified devices.

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