Diamfab raises €8.7 million for diamond semiconductor pilot line
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Diamfab SA (Grenoble, France), a 2019 startup that produces diamond epitaxial wafers, has raised a €8.7 million round of funding.
The company is trying to develop an ecosystem to support a diamond semiconductor industry. Diamond, an allotrope of carbon, is theoretically a superior material to silicon-carbide for power applications.
Protected by four patents, the company’s expertise lies in the growth and doping of thin diamond layers, as well as in the design of diamond electronic components.
Diamfab raised the money from Asterion Ventures, Bpifrance and Fonds Régional Avenir Industrie Auvergne-Rhône-Alpes and others. BPIFrance’s investmen comes from the French Tech Seed fund that it manages on behalf of the French government as part of France 2030, and Grenoble Alpes Métropole.
The money will be used to set up a clean room and pilot line which is due to complete by the end of 2024.
Diamfab is working with Soitec, Murata, STMicroelectronics, CEA and Schneider Electric, on the possibilities of the technology. “The pilot project will catalyze many discussions with our partners and strengthen our relationships,” said Gauthier Chicot, Chairman of Diamfab, in a statement.
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