Die sized packaging reduces DC-DC converter footprint in battery design
Texas Instruments (TI) has launched a buck-boost DC-DC converter family with wafer scale packaging to minimise the board space.
The noninverting TPS63802, TPS63805, TPS63806 and TPS63810 buck-boost DC-DC converter devices offer wide input and output voltage ranges that scale to support multiple battery-driven applications in a 15-pin, 1.4-mm-by-2.3-mm die-size ball grid array (DSBGA).
Each of the devices in the family automatically selects buck, buck-boost or boost mode according to the operating conditions. Their complete solution size of 19.5 mm2 to 25 mm2 – up to 25% smaller than similar devices – is a result of compact packaging, an advanced control topology requiring few external multilayer ceramic capacitors, and 0.47µH inductors. The devices have a 1.3-V to 5.5-V input range and 1.8-V to 5.2-V output voltage range with an output up to 2.5A, which helps engineers speed their designs and encourages reuse across multiple applications.
The DC-DC converter family has a low quiescent current (IQ) of 11 to 15µA for light-load efficiency while minimizing power losses and extending run times in battery-driven applications such as portable electronic point-of-sale terminals, grid infrastructure metering devices, wireless sensors and handheld electronic devices.
The TPS63802 is a 2-A buck-boost converter with low 11-µA IQ consumption suitable for pulsed-load applications such as industrial Internet of Things devices.
The TPS63805 is a 2-A buck-boost converter with a 22-µF output capacitor and 0.47-µH inductor resulting in a small solution size of 19.5 mm2 that meets the requirements of handheld industrial and personal electronics applications.
The TPS63806 is a 2.5-A buck-boost converter with a focus on improved load-step regulation for applications with an aggressive load profile that require tight regulation, such as time-of-flight sensors in smartphones, cameras or augmented reality devices.
The TPS63810 is a 2.5-A buck-boost converter with I2C interface for dynamic voltage scaling through either a two-wire interface or the VSEL pin, enabling the device to serve as a pre-regulator or voltage envelope tracker for systems found in smartphones, wireless hearing aids or headphones.
The TPS63805 and TPS63806 devices are available in production quantities through the TI store and authorized distributors. Pre-production samples are also available for the TPS63802 and TPS63810 devices
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Product |
Package type |
Price |
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Evaluation |
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TPS63802 |
10-pin, 2-mm-by-3-mm thermally enhanced HotRod quad flat no-lead (QFN) |
US$0.98 |
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TPS63805 |
15-pin, 1.4-mm-by-2.3-mm die-size ball grid array (DSBGA) |
US$0.98 |
|
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|
TPS63806 |
15-pin, 1.4-mm-by-2.3-mm DSBGA |
US$1.05 |
|
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TPS63810 |
15-pin, 1.4-mm-by-2.3-mm DSBGA |
US$1.09 |
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Download the data sheets for the TPS63802, TPS63805, TPS63806 and TPS63810 buck-boost converters.
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