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Digital audio SoC packs 2×20 W in footprint

Digital audio SoC packs 2×20 W in footprint

New Products |
By eeNews Europe



The device extends ST’s SoundTerminal family, combining advanced process and chip-scale package technologies with digital audio IP such as ST’s proprietary FFX full flexible amplification.

The STA333IS has the technologies and audio IP to combine advanced signal processing and power circuitry on a single chip. With its wide operating voltage range, from 4.5 V to 18 V, it is ideal for battery-operated equipment as well as space-constrained products such as LCD or LED televisions, docking stations and digital wireless speaker systems.

The STA333IS delivers superb audio quality that goes hand in hand with outstanding thermal efficiency and low electromagnetic emissions, and the tiny 8.3 mm2 footprint gives extra freedom to style new generations of audio products.

Also available, the STA333SML variant for ‘micro-less’ applications operates without an external microcontroller, enabling designers to create digital amplifiers with the lowest cost of ownership.

Availability and Pricing

Samples and production quantities of the STA333IS and STA333SML are available now as 5×6-bump 0.5mm-pitch Chip-Scale Package (CSP) devices, priced from $1.00 for orders over 1,000 pieces.

More information about the STA333IS digital audio system at
www.st.com/sta333is

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