Direct thermal exchange package configurations for LED assemblies
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By
eeNews Europe
Thermal Management designs and engineering are an area of specialization and focus for Electronic Interconnect who provides thermal transfer through the thermal pads. Any base metal thickness can be used with any typical dielectric, including FR-4, epoxy, and polyimide. Additionally, no PCB design change is required, so the technology can be implemented simply, quickly, and at minimum cost and without undue complications.
Visit Electronic Interconnect at www.eiconnect.com
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