Dispensable thermal interface material protects outdoor LED luminaires

Dispensable thermal interface material protects outdoor LED luminaires

New Products |
AI Technology, Inc. (AIT) has introduced a new class of thermal interface material that dispenses like a thermal pad, but performs with characteristics like that of a grease or gel when device temperatures increase to above 45°C.
By eeNews Europe


COOL-PAD CPR7154 is optimized to accommodate large areas with different heights and gaps of less than 3-mil along its interfacing area. The material is filled with a modified oxide mixture and is electrically insulating at normal voltage. The material is designed to have high compressibility as applied in comparison to traditional thermal pads.  

Designed for thermal interface applications, COOL-PAD CPR7154 is capable of withstanding the worst of temperature and moisture exposure in outdoor LED luminaire applications with modules from Philips, Cree, Bridgelux and such like. COOL-PAD CPR7154  is also ideal for CPU modules and graphic card interfaces in laptops and desktops.

Once the device temperature reaches 45°C, COOL-PAD CPR7154 will ‘melt-flow’ to fill even the smallest of trapped air along the interface between the device and heat-sink or heat-spreader.

COOL-PAD CPR7154 is semi-tacky on both sides for optimum thermal transfer performance. COOL-PAD CPR7154 has high thermal conductivity and low Tg characteristics that impose minimum thermal stress on bonded parts during thermal cycling or shock testing.  While COOL-PAD has some intrinsic tack strength, it is not designed for bonding.  A mechanical fastener must be used to provide assembly integrity.
A mechanical fastener of 5 psi or more is recommended to provide intimate contact between the COOL-PAD and the interfacing surface.  Because COOL-PAD is compressible, it will fill in uneven height differentials and warps between the mating surfaces.  The ultimate performance of COOL-PAD is achieved after the first cycle of melt-flow phase-change at 45°C or automatically when the device heats up during operation or with externally applied heat if the device is not anticipated to reach 45°C .

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