DoD extends partnership with Globalfoundries on secure chips
Fab 8 is Globalfoundries’ most advanced manufacturing facility and it will be used to run a 45n SOI manufacturing process to produce ICs for defense and aerospace applications. The agreement has been enabled by Fab 8 achieving compliance with the US International Traffic in Arms Regulations (ITAR) and Export Administration Regulations (EAR).
The first chips from this expanded agreement are expected to begin delivery in 2023. Globalfoundries is in ongoing discussions with the DoD regarding Trusted Accreditation for Fab 8. Globalfoundries currently supplies the DoD with those chips out of Fab 10 in East Fishkill New York and Fab 9 in Burlington, Vermont. Both of these latter facilities were previously IBM wafer fabs.
In a supporting statement the Department of Defense said: “This agreement with Globalfoundries is just one step the Department of Defense is taking to ensure the U.S. sustains the microelectronics manufacturing capability necessary for national and economic security. This is a pre-cursor to major efforts contemplated by the recently passed CHIPS for America Act, championed by Senator Charles Schumer, which will allow for the sustainment and on-shoring of U.S. microelectronics capability.”
“We are proud to strengthen our longstanding partnership with the US government, and extend this collaboration to produce a new supply of these important chips at our most advanced facility, Fab 8, in upstate New York,” said Tom Caulfield, CEO of Globalfoundries in a statement.
Related links and articles: