Credo Technology in the US has launched a family of digital signal processing chips for 800Gbit/s interconnect in data centres.
The Dove 800 DSP support PAM4 modulation for high speed links in hyperscale Data Centre and AI applications.
“Continuous increase in data traffic, driven by applications such as AI and AR/VR, is fueling the demand for optical modules with increased throughput and switch ASICs with 100Gbps serial interface,” said Vlad Kozlov from LightCounting Market Research. “In fact, we have increased our forecast for 800G transceivers reflecting higher level of investments planned by Meta. Credo’s high-performance 400Gbps and 800Gbps DSPs are critical to enabling this next generation infrastructure, while providing the power and price required for rapid market deployment and volume ramp up.”
“Credo is delivering a comprehensive solution with the Dove 800 family – its low-power, high-performance design, combined with integrated drivers and bias-T components, will enable customers to simplify PCB design, improve yields and reduce module costs,” said Scott Feller, Vice President of Marketing at Credo. “The Dove 800 family supports low-cost, quick implementation required to support the hyperscale and AI applications driving the demand for high-density switching systems.”
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The Dove 800 family includes Dove 800/801/802 for OSFP and QSFP-DD800, and 400Gbps Dove 410/401/401 for QSFP112 optical transceivers.
The DSPs come with integrated EML, TFLN and silicon photonics modulator drivers with 100G PAM4 on both the electrical host and optical line side. Line side receivers include non-linear cancellation and reflection cancellation to improve yields, while reducing module cost. High-performance transmitters come with multi-tap FIR filters and non-linear cancellation, allowing precision optimization at both the module electrical connector and optical interface.
The host side interface supports up to 30dB insertion loss channel, connecting seamlessly with different length switch interfaces without the need for customized per-channel settings and the family comes with EML, TFLN and Silicon Photonics drivers and bias-T but allows use with external laser or modulator driver support to provide customers with maximum flexibility.
Independent phase locked loops per channel support flexible breakout configurations including 2x400G, 4x200G and 8x100G using an on-chip crossbar that simplifies module layout design.
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