Dual 25V MOSFET package targets servers and telecoms supplies
The AONX38168XSPairFET includes the low-side and high-side MOSFET in a leadless surface mount package, (5mm x 6mm outline) for synchronous DC/DC converter applications.
The AONX38168 is designed with the latest bottom source packaging technology which has a lower switch node ringing due to lower parasitic inductance. The new device offers a higher power density comparative to existing solutions, and is aimed at server and telecommunication markets. The AONX38168 is the newest generation of XSPairFETs, offering the lowest on-state resistance and best Figure of Merits (Rdson x Qg) (see chart below). The XSPairFET has bottom source connection for the low-side MOSFET which can result in improved thermal performance, simplified layout, and reduced EMI.
“With the significant performance improvement, the AONX38168 allows new designs to operate at higher switching frequencies. In addition, AOS can offer a complete solution with Digital Power and Power IC products for DC/DC voltage regulation for demanding applications in server and telecommunications,” said Peter H. Wilson, Marketing Director of MOSFET product line at AOS.
The AONX38168 is immediately available in production quantities with a lead-time of 12-14 weeks. The unit price for 1,000 pieces is $1.70.
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