DuPont and IQLP to cooperate in developing high-speed circuit technology
DuPont Circuit & Packaging Materials (DuPont) and IQLP, a division of Interplex Industries, have announced ongoing efforts to further develop and refine liquid crystal polymer (LCP) thin-film technology for use in high-speed circuit applications. This continues an existing joint development agreement and a license agreement, aimed at technology to be commercialised by DuPont, of products for use in the production of circuits for applications such as smart phones, telecom, internet infrastructure, high-speed computing and radar sensing devices.
DuPont and IQLP anticipate that their ongoing LCP thin-film technology research and development program will ultimately lead to the development and commercialization of dielectric materials that can offer electrical properties up to and over 100 Ghz. IQLP’s material science – an advancement over current technology – provides tailorable properties, such as dielectric constant (Dk) and dissipation factor (Df), a tight control over dielectric thickness, and is capable of being manufactured in a high-volume, roll-to-roll format.
Potential products that DuPont may develop which incorporate LCP thin-film technology may include double-sided copper clad laminates, along with LCP bond ply materials for use in fabricating multilayer circuit boards. Successful development and commercialisation of products that incorporate LCP thin-film technology would allow DuPont to provide a wider range of products in the high-frequency laminate marketplace, and would complement its existing DuPont Pyralux flexible circuit materials and Interra embedded passive materials for rigid circuit boards product lines.
“DuPont has been developing and expanding its product line for high-speed, high-frequency applications,” said Michael Hennessy, global technology director, DuPont Circuit & Packaging Materials. “We anticipate that our collaboration with IQLP will lead to opportunities to broaden our existing range of advanced materials for high-speed, high-frequency applications and accelerate time to market for such products.”
“We have been collaborating with DuPont in the area of advanced materials for a number of years,” said Mike Zimmerman, founder and chief executive officer, IQLP. “IQLP has been working on the development of LCP thin-film technology since 2007…working with DuPont to further develop, refine and ultimately commercialise this technology for the high-frequency film market.”
DuPont Circuit & Packaging Materials offers a portfolio of products including dry film photoresists and phototooling films for PCB imaging, polyimide films, flexible circuit materials, embedded passive materials and thermal substrates for LED lighting.
DuPont; www2.dupont.com/Pyralux/en_US/sales_support/index.html
IQLP, LLC was initially founded as Quantum Leap Packaging in 2002 as a materials company developing products in semiconductor packaging, including the creation of its Quantech Material Technology. The company is focused on the development of the next generation of products for semiconductor packaging, film/laminates, structural plastics and automotive applications.
IQLP; www.IQLP.net
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