€29m for 6G chiplet packaging line in Finland
VTT in Finland has been awarded €29m for the APECS packaging pilot line for 6G and RF chiplet devices.
The Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS) is one of the six pilot lines funded under the EU Chips Act. APECS will focus on the development of reliable packaging for microchips and innovative combinations of semiconductor materials and technologies, including chiplet integration
“In the APECS project, VTT will focus in particular on the radio frequency technologies required for the 6G network and on the development and demonstration of optical microsystems and chip packaging methods,” says Tauno Vähä-Heikkilä, Vice President, Microelectronics and Quantum Technologies at VTT.
VTT is also part of the FAMES, NanoIC and PIXEurope pilot lines. The FAMES and NanoIC pilot lines are run by CEA-Leti of France and imec of Belgium and with APECS will be hosted in Kvanttinova with a €79m backing from the Finnish government, €29m for APECS.
Kvanttinova is an RDI Hub in microelectronics and quantum technology, jointly developed by VTT, Aalto University and the City of Espoo with a shared-use cleanroom that enables domestic companies to develop and pilot microelectronics components, systems and innovation and scale them up for production. The first semiconductor processes in Finland will start up towards the end of 2026.
Negotiations on the development of the PIXEurope pilot line for photonic chips coordinated by ICFO, the Institute of Photonic Sciences in Barcelona are continuing.
“Taken together, these four pilot lines, APECS, FAMES, NanoIC and PIXEurope, will support the growth of the Finnish and European semiconductor industry and help Finnish industry to connect to European value chains,” says VTT’s Research Manager Pekka Pursula.
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
