The biggest news was a mention by Infineon CEO Reinhard Ploss that plans to improve silicon-carbide material efficiency were coming to market with the cold-splitting of silicon-carbide wafers.

1 Infineon ‘cold-split’ SiC ready for production

This was followed by interest in when the current boom phase of the semiconductor cycle might go into reverse.

2 A forecast of when the chip market will decline

3 Tower plans to make RFSOI at ST’s Agrate wafer fab

4 Neumonda formed as European memory company

Personally I found the CEO interview I conducted with Minima Processor’s Tuomas Hollman particularly interesting as it ranged over IP, EDA and into the need for novel circuit design styles and philosophies; something less deterministic and more dynamic.

5 CEO interview: Minima’s Tuomas Hollman on why static timing sign-off is over

And the sixth most popular story is intriguing.

6 Intel pays $125 million for Via’s x86 designers

7 IBM adopts Neureality for AI inference

8 Singapore GaN startup selects Netherlands for European R&D base

Meanwhile the geopolitics due to the strategic nature of semiconductor capability continues to catch readers’ attention

9 SK Hynix caught up in US-China geopolitics

10 Canadian coalition lobbies for strategic semiconductor support

Related links and articles:

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Glass substrate factory for chiplet packaging coming to Georgia

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