Electrically conductive adhesive compatible with lower-cost, tin-terminated components
The benefits of ECAs are well-established and include lower temperature processability, more streamlined manufacturing techniques, lower stress assemblies and regulatory-compliant lead-free formulations. Historically, one of the few drawbacks associated with ECAs has been the materials’ inability to cope with non-noble metals on component terminations, making them useful primarily with palladium silver-, silver-, or gold-finished components.
"Ablestik ICP3535M1 is extremely adaptable," notes Tom Adcock, Henkel’s Global Product Manager for Assembly Adhesives. "Not only does it deliver significant savings in the form of lower cost component use, but the material also provides reliable component assembly to a variety of substrates including low-temperature co-fired ceramics (LTCCs), high-temperature ceramics, and OSP-finished printed circuit boards (PCBs). This flexibility is central to reducing supply-chain complexity, allowing manufacturers to source a single material for multiple applications."
The material maintains its stable contact resistance and good mechanical integrity after 3,000 hours of temperature and humidity testing, 3,000 cycles of thermal shock evaluation and 3,000 hours of heat storage. The new ECA also exhibits excellent performance with very small components such as 0402s, displaying absolutely zero bridging or wicking with highly miniaturized devices, claims the manufacturer.
Visit Henkel Electronic Materials at www.henkel.com
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