Eliyan tops $100m for chiplet interconnect
Chiplet interconnect pioneer Eliyan has raised additional financial backing to take its total backing to over $100m.
The strategic investment from VentureTech Alliance into Eliyan follows fund raising of $60m in its Series B round in March. The cash will be used to boost the commercialization of its existing Bunch of Wires technology and expand its product line for die-to-die (D2D), die-to-memory (D2M), chip-to-chip (C2C) interconnect. It will also develop its series of custom and standard memory and IO subsystem chiplets.
“The value proposition and technical differentiation Eliyan has demonstrated in leading edge manufacturing processes, leveraging both advanced and standard packaging, is resonating across the AI chip ecosystem. We are pleased to have such broad reaching financial and strategic support from the world’s leading foundries and memory suppliers,” said Ramin Farjadrad, co-founder and CEO of Eliyan.
“We have entered a new phase in the company’s evolution as we ready our first products for commercialization while in parallel are seeing increasing demand for our approach to enable high-performance, power efficient interconnect in multi-die architectures.”
“Eliyan’s technology for interconnect of multi-die architectures addresses many of the key manufacturing challenges in terms of packaging, scalability, and flexibility. From a foundry perspective, we see a significant market opportunity for their technology to be an important enabler in the emerging chiplet ecosystem,” said Kai Tsang, Managing Partner at VentureTech Alliance.
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
