EM simulator technology tackles advanced product designs
Its HFSS Mesh Fusion technology, says the company, drives rapid and fully coupled simulation of complex electromagnetic (EM) systems – without compromising the design or fidelity. The technology is designed to address the ever increasing complexity and sophistication of modern electronic products, which require engineers to solve complex interactions between components and across systems – critical for designing cutting-edge artificial intelligence machine learning, autonomous vehicle, 5G communications, high-performance computing, and Industrial Internet of Things applications.
“HFSS Mesh Fusion helps IC designers effectively manage the capacity, complexity, dimensional range and density of geometric detail in a fully coupled EM simulation,” says John Lee, vice president and general manager at Ansys. “This empowers engineers to break the old rules, innovate leading-edge designs at higher frequencies and within tighter form factors, tape out with confidence and deliver trailblazing products with more functionality than ever thought possible. This supports numerous highly sophisticated applications, including 5G communications, autonomous driving and many more.”
Available in the company’s HFSS 2021 R1 3D EM field simulator, HFSS Mesh Fusion helps engineers combine integrated circuits (ICs), packaging, connectors, printed circuit boards, antennas and platform in a single Ansys HFSS analysis to predict EM interactions. The technology bypasses previous barriers by applying optimal meshing technology at the component level, parallelized across cores, clusters or within Ansys Cloud.
A breakthrough solver technology then extracts a fully coupled, uncompromised, full-wave EM matrix. By enabling much more complex designs to be solved, says the company, companies can confidently push the limits of performance to create state-of-the-art products.
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