EMA automates PCB footprint generation for Allegro PCB Design
The process, driven by rules, settings, and component dimension in forms, accurately builds parts in a consistent and repetitive process. An extensive set of component families are supported including BGA, CHIP, CHIPARRAY, DIP, LCC, LGA, PLCC, QFN, QFP, SOJ, and SOP with additional families added on a continuing basis. FootprintGen supports multiple user settings with user configurable line and text widths for solder mask, assembly, pad, and other layers.
Designers can select from D-shape, oblong, or rectangular pad shapes, or they can customize a specific pad shape with rounding or chamfering specifications. Pad stacks are user configurable and can be assigned to unique locations including corner pads or specific row/column positions.
FootprintGen integrates seamlessly with Cadence OrCAD and Allegro PCB design solutions, complementing existing apps including SymbolGen. Using FootprintGen, PCB footprint models can be verified and correlated to the schematic symbol models, immediately identifying any errors or discrepancies. For more information about FootprintGen and the other available apps, visit www.ema-eda.com/orcadapps
Visit EMA Design Automation at www.ema-eda.com
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