End-to-end sub-1-GHz kit for easy cloud connectivity
In the growing industrial IoT market, there is a need for connecting long-range low-power applications to the cloud. Developers face many challenges: they need a long-range low-power wireless protocol with regional regulatory compliance, and security is critical.
“Sub-1 GHz offers low-power and long-range wireless connectivity, but it doesn’t offer a native IP internet connectivity and is a fragmented band without a standard, making it complex to create a fully managed solution from the end nodes to the cloud,” says Simon Meadmore, Global Head of SEPO and SBC at Premier Farnell and Farnell element14.
The kit contains all the components needed to create a full sensor network, including a gateway design based on the BeagleBone® Black, the BeagleBone Wireless Connectivity Cape, and the TI SimpleLink dual-band CC1350 wireless MCU LaunchPad™ development kit acting as the MAC co-processor. The kit also includes an additional CC1350 wireless MCU LaunchPad kit acting as a long-range sensor node.
To provide a seamless out-of-the-box experience, the hardware comes pre-flashed with the SimpleLink CC13x0 software development kit (SDK), including the TI-15.4 stack for Sub-1 GHz star network connectivity and the TI Processor SDK Linux. It also provides a flexible IoT cloud interface giving the user the option to connect to a number of different cloud providers and addresses the challenges that developers face with building a long-range Sub-1 GHz network with cloud connectivity.
The SimpleLink sensor-to-cloud development kit is a robust, reliable, tool that is ready to be certified for regulatory compliance and has the necessary hardware and pre-integrated software to make it easy for users to being developing. The TI 15.4 stack provides a standards-based Sub-1 GHz network that is easy to use and alleviates the complexity of linking a user’s own Sub-1 GHz wireless network to the cloud.
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