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Enhanced 3D antennas integrate SMT components for optimised PCB footprint

Enhanced 3D antennas integrate SMT components for optimised PCB footprint

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By eeNews Europe



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Incorporating SMT components with the 3D LDS antenna structure saves space on the mobile device’s printed circuit board and optimizes the use of available space on the antenna. The antenna can be matched and tested as one RF unit prior to phone assembly and frequency variants, tuning, and late optimization changes can be done quickly and cost effectively. This avoids costly rework or rebuild of the mobile device’s main PCB and improves time-to-market.

These high-performance RF antennas are designed through direct laser structuring onto a molded 3D surface, they are RoHS compliant.

Visit Pulse Electronics at www.pulseelectronics.com

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