Enhanced chip-scale LED packages boost output efficacy
The LM101B and the LH231B packages are based on Samsung’s state-of-the-art, fillet-enhanced CSP (FEC) technology, which forms TiO2 walls around the chip surface to reflect its light output toward the top, acting as a plastic mould in conventional EMC-based LEDs.
With their FEC design, the packages provide a higher light efficacy level compared to Samsung’s previous generation of CSP LEDs. The more focused beam also helps to eliminate cross-talk between neighbouring packages and enables the new packages to be placed in close proximity to one another, offering greater flexibility to luminaire designers.
The LM101B delivers 200lm/W (Ra80 5000K, 65mA, 25˚C) and its low thermal resistance (2K/W) and high reliability (0.5W, 105˚C, L90>50000 hours) make it optimised for spotlights and high-bay applications where high efficacy and long lifespan are required. With an operating current of 2A (max. 6W), the LH231B offers an efficacy of 170lm/W (Ra70 5000K, 700mA, 85˚C). Thanks to Samsung’s FEC structure, the 120-degree beam angle allows for simple optic designs, making it also suitable for outdoor applications, such as street and parking lot lighting.
Samsung Electronics – www.samsung.com
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
