Enhanced e·MMC Version 5.1 compliant embedded NAND flash
These products integrate NAND chips fabricated with 15-nm process technology with a controller to manage basic control functions for NAND applications in a single package. The devices are designed for application in a wide range of digital consumer products, including smartphones, tablets and wearable devices. Samples of the 16GB (THGBMHG7C2LBAIL) and 64GB (THGBMHG9C8LBAIG) products are now ready to ship, with 32GB (THGBMHG8C4LBAIR) and 128GB (THGBMHT0C8LBAIG) products to follow. Embedded in a system, the 128GB products can record up to 16.3 hours of full spec high definition video and 39.7 hours of standard definition video.
In October 2014, Toshiba launched the first e•MMC products supporting all mandatory features of JEDEC e•MMC Version 5.1, which was officially issued by JEDEC on February 24, 2015. The new additions to the line-up support two optional features of e•MMC Version 5.1, “command queuing” and “secure write protection”. The JEDEC e•MMC Version 5.1 compliant interface simplifies system development, allowing manufacturers to minimise development costs and speed up time to market for new and upgraded products. The devices handle all essential NAND memory management functions including wear-levelling, bad block management, garbage collection and error correction.
Additionally, new features standardized in JEDEC e•MMCTM Version 5.1, such as Background Operations (BKOPS) control, Cache Barrier, Cache Flushing Report and Large Replay Protected Memory Block (RPMB) Write, are applied to the new products to enhance usability.
The “command queuing feature” allows users to process multiple tasks generated by the user’s issue of multiple commands, in the order of the user’s preference, by initially storing the tasks in a waiting queue. It improves random read performance speed by approximately 30% at maximum compared to products without the “command queuing feature”. It effectively improves the user experience when simultaneously executing multiple applications on mobile devices, including smartphones and tablets.
The “secure write protection feature” expands the conventional write protect feature and protects the user’s important data stored in an assigned area from being overwritten or erased by unauthenticated users.
Available in a 153 ball FBGA package measuring 11.5 x 13.0 mm the memory devices feature an HS-MMC interface. They support an operating temperature range of -25C to +85C, core voltage range of 2.7V to 3.6V and interface voltage ranges of 1.7V to 1.95V and 2.7V to 3.6V.
Toshiba Electronics Europe; www.toshiba.semicon-storage.com