EnSilica in optical computing ASIC deal
UK design house EnSilica has signed a multimillion-pound design and manufacturing services contract with a well-funded optical computing systems startup.
The deal includes substantial design services engagement and additional manufacturing services.
This follows recent contracts for an ASIC for resilient GNSS navigation systems, as well as one for satellite broadband chips and a ten year deal with Siae Microelettronica in Italy for an ASIC for microwave telecoms systems.
This is part of an expansion to provide wafers, packages, and tested devices along with design services. This model, successfully executed by several Asian companies including Socionext, Alchip, and Global Uni Chip (GUC), is now being used to provide a resilient European-based supply chain.
“We are pleased to secure this sizable contract with a pioneering optical computing systems company. This agreement not only underscores our capabilities in delivering comprehensive design and manufacturing services but also highlights the growing demand for European-based supply chains,” said Ian Lankshear, CEO of EnSilica.
“Our strengthened relationships with key wafer foundry and semiconductor supply chain partners enable us to provide high-quality wafers, packages, and completed tested devices.”
The increased demand means EnSilica has opened a second design centre in Campinas, São Paulo State, Brazil.
“We are also delighted to be opening our second design centre in Brazil, which further underscores our strategic ambitions to expand our global footprint in order to meet the increasing demand for our services,” he said.
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