EnSilica signs IoT ASIC deal with Indesmatech

EnSilica signs IoT ASIC deal with Indesmatech

Business news |
By Nick Flaherty

UK chip design house EnSilica has signed a strategic partnership on custom chips with Danish module distributor and developer IndesmaTech.

The companies will collaborate to develop custom ASICs for next generation modules for the Internet of Things (IoT) for IndesmaTech’s customers across northern Europe, including throughout Germany, the UK and Scandinavia.

IndesmaTech is based in Denmark and set up its ASIC division in September with five chip design staff. The new division is aiming at wireless communications, audio, healthcare and Smart IoT sensing.

  “The partnership helps us lower the cost of entry to companies considering taking an ASIC approach either for improved product performance or to protect the supply chain,” said Peter Jeuter, EnSilica’s VP of sales, adding: “This deal and the incredible experience of the team at IndesmaTech should help make ASICs more accessible to a greater number of companies looking to take an ASIC approach.”

“Our joint venture aims to accelerate the development of tailor-made IoT devices, offering faster, more efficient, and highly customizable solutions to meet the evolving demands of diverse industries…Our collaboration is designed to cater to specific client needs, ensuring a seamless integration of our advanced ASIC technologies into their IoT applications,” said Indesmatech.



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