Ensilica signs ten year microwave chip deal in Italy
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Ensilica in the UK is to design custom microwave and RF telecoms chips for Siae Microelettronica in Italy.
The ten year deal will see Ensilica design ASICs for Siae Microelettronica for the European EMISPHERE programme.
This €181m Italian programme is a key IPCEI project for the in-house development of innovative modem chips, microwave components and the antennas to enable the next generation microwave radio links to reach 100 Gbit/s transport capacity in the W and D band.
Siae is also developing ready-to-market products in the Radio Access portion of the network using the O-RAN open standards.
Ensilica will integrate Siae Microelettronica microwave and millimeter wave radio designs into the custom ASICs
“This partnership is the base of a successful project output, representing a very critical part of the overall IPCEI EMISPHERE project, which is a key element for Siae Microelettronica’s plan for growth of technological solutions and expansion into new markets”, said Stefano Poli, Siae Microelettronica Group Managing Director.
EnSilica says its extensive expertise in developing high-performance radio frequency and complex digital systems for satellite receivers and its robust and well-documented supply chain management capabilities were pivotal in securing the ASIC contract.
Reducing development risk is key and EnSilica demonstrated how these risks can be mitigated giving Siae confidence in the selection of EnSilica. This comes alongside the usual benefit of ASICs in terms of saving power, cost and size whilst protecting smart IP deep within the ASIC.
“We are delighted that Siae Microelettronica SIAE MICROELETTRONICA selected our technical and commercial offering. As the demand for even higher data rates and the push for more power-efficient systems increases at pace, ASICs are becoming essential for the next generation of terrestrial and satellite telecommunications equipment” commented Paul Morris, VP RF and Communications Business Unit at EnSilica “And we look forward to working closely with their team to turn this project into a commercial success for both parties.”
“Our partnership is a strategic move that leverages EnSilica’s expertise in ASIC design and SIAE’s deep understanding of the microwave market” commented Claudio Passera, Siae Microelettronica Group R&D Director “and this unique combination positions us to develop innovative platforms and products that address the critical needs of emerging applications beyond 5G. By combining our strengths, we’re gaining a significant competitive advantage and delivering customer-centric solutions that will solidify our leadership in the microwave radio and wireless network solutions space.”
Ian Lankshear, Chief Executive Officer of EnSilica, added: “This significant contract marks the beginning of what we hope will be a long-term and mutually beneficial partnership with a key telecoms client. Our ability to both develop and deliver highly complex solutions continues to drive some of the world’s leading equipment manufacturers to select EnSilica as the partner of choice.”
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